Photo of OIPT process engineer, Mohsen, Shona, and Radka (left to right).
We have commissioned a brand new Oxford Instrument PlasmaPro 80 PECVD kit. Offering a compact, small footprint, versatile deposition system with convenient open loading, this system will enable the development of new plasma recipes for optoelectronic and nanoscale optical devices. This system enables excellent control and rate determination, wafer temperature and deposition uniformity for the deposition of silicon oxide, silicon nitride, and amorphous silicon. We are very thankful to EPSRC's Capital Award for Core Equipment: EP/T023899/1 for bringing this kit to the Oxford Materials Begbroke Cleanroom, under the leadership of Prof Harish Bhaskaran
